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AOI SMT 3D Inspection Equipment System For Semiconductor

Product Details

Place of Origin: DONGGUAN

Brand Name: MENTO

Certification: FCC.ROHS,CCC

Model Number: K2005DW

Payment & Shipping Terms

Minimum Order Quantity: 1

Packaging Details: W1300xD1600xH1650mm

Delivery Time: 20 work days

Supply Ability: 1000PCS/M

Get Best Price
Product Details
Highlight:

AOI SMT 3d inspection equipment

,

Semiconductor 3d inspection equipment

,

3D semiconductor inspection system

Features:
Ultra High Precision 3D AOI
Thickness:
0.5mm-6mm
Appicable Pcb Size:
50*50 - 250*330mm
Connectivity:
Compatible With Industry-standard Communication Protocols
Detection Speed:
0.6 FOV/sec
Item:
SMT AOI PCB Machine,AOI Systems
Inspection Area:
Up To 510mm X 460mm
Power Supply:
AC 220V, 50/60Hz
Warranty:
1 Year
Stock:
Large
Width Adjustment:
Manual
The Machine Size:
W1080 X D1390 X H1840(mm)
Speed:
0.23sec/FOV
Marketing Type:
New Product 2020
Quality:
Top
Features:
Ultra High Precision 3D AOI
Thickness:
0.5mm-6mm
Appicable Pcb Size:
50*50 - 250*330mm
Connectivity:
Compatible With Industry-standard Communication Protocols
Detection Speed:
0.6 FOV/sec
Item:
SMT AOI PCB Machine,AOI Systems
Inspection Area:
Up To 510mm X 460mm
Power Supply:
AC 220V, 50/60Hz
Warranty:
1 Year
Stock:
Large
Width Adjustment:
Manual
The Machine Size:
W1080 X D1390 X H1840(mm)
Speed:
0.23sec/FOV
Marketing Type:
New Product 2020
Quality:
Top
Product Description

Down-illuminated AOI

1. High detection, low misjudgment

2. Unique chain track

3. Rich detection algorithms can effectively target DIP defects

4. Two-person re-judgment repair stations can be implemented according to the inspection ratio.

Application scope: solder joint and mounted device inspection

 

Device model K2005DW
Detection capacity Detection items CHIP component body, CHIP component solder joints, characters, DIP solder joints
Smallest component CHIP:0201 Pitch:0.3mm
Detection method Algorithm parameter debugging, machine learning
Optical system Camera 5MP high speed color industrial camera
Telecentric lens 0.22X/0.17X
Resolution 15um/20um/25um
FOV 36x30mm/48x40mm/61x51mm
Detection speed 3FOV/s
Software system Operating system Windows 10
Mechanical property PCB Thickness 0.3~10mm(warpage≤5mm)
Component Height 180mm upper, 30mm lower (special height can be customized)
Driving equipment Servo motor + ball screw + linear slide
Moving speed Max.600mm/s
Positioning accuracy ≤8um(after calibration)
PCB transport rail PCB rail transportation height: 900±20mm (from the ground to the PCB guide rail transportation surface)
PCB maximum size: 510mmx460mm
PCB minimum spacing: ≤90mm
Parameters Power source AC220V/50Hz/2000W
Overall size W1140mmxD1400mmxH1600mm (excluding foot 100±20mm)
Weight ≈700KG
Air Pressure ≥0.5MPa
Environmental requirements Temperature: 5~40℃, relative humidity 25%~80% (no frost)
Upstream and downstream equipment communication Standard SMEMA interface