Dongguan MENTO Intelligent Technology Co., Ltd. info@mento-mv.com 00-86-13410031559
Product Details
Place of Origin: DONGGUAN
Brand Name: MENTO
Certification: FCC.ROHS,CCC
Model Number: K3212
Payment & Shipping Terms
Minimum Order Quantity: 3
Packaging Details: W1350xD1000xH1600mm
Delivery Time: 20 work days
Payment Terms: L/C, T/T
Supply Ability: 10pcs+20 work days
Aoi: |
Automated |
Pcb Thickness: |
0.2mm - 6mm |
Dimension: |
1000mm X 800mm X 1500mm |
Camera: |
High-resolution Digital Camera |
Light Source: |
LED |
Inspection Accuracy: |
99.9% |
Software: |
Advanced Image Processing Software |
Aoi: |
Automated |
Pcb Thickness: |
0.2mm - 6mm |
Dimension: |
1000mm X 800mm X 1500mm |
Camera: |
High-resolution Digital Camera |
Light Source: |
LED |
Inspection Accuracy: |
99.9% |
Software: |
Advanced Image Processing Software |
Online AOI features
1. High cost performance
2. Standard 5 million global exposure industrial color camera
3. The first company in China to use large-diameter telecentric lenses (can be targeted at products)
4. Independently developed optical system (light source consistency)
5. High stability integrated casting platform
Application scope: solder joint and mounted device inspection
K32 series 3D Solder Paste Inspection
| Device model | K3212 | |
| Detection capacity | Detection items | Miss print, over solder, insufficient solder, solder bridging, solder paste tailing, shape anomany, offset |
| Scanning method | Stop&Go | |
| Optical system | Camera | 12MP high-speed color industrial camera |
| Light Source | Dual DLP light source (raster phase shift technology) and red, green and blue (RGB) light source | |
| Resolution | 10μm & 15um (optional) | |
| Detection performance | Height accuracy (calibration module) | 1μm (using standard calibration block) |
| Volume repeatability | <1% (standard verification block, 3Sigma) | |
| Maximum Plate Bending Compensation Value | ±3mm | |
| Detection Capability GRR | <10%at6o(+50%tolerance, 5μm resolution) | |
| Maximum detection height | 500μm | |
| Solution to shadow problem | Phase shift technology & bidirectional 3D Structured Light system | |
| Plate bending real-time compensation method | Plate Bend Compensation (Z-Tracking+Pad Referencing) | |
| Test screen | Color (3D and 2D images displayed together) | |
| Driving equipment | Servomotor+Screw Guide | |
| Moving speed | 800mm/s | |
| Minimum measurable product size | 50mmx50mm | |
| Maximum product measurable size | 400mmx500mm | |
| PCB thickness | 0.5~6mm | |
| Track width adjustment | Automatic width adjustment, manual width adjustment | |
| Circuit board conveying/fixing | Belt conveyor/pneumatic clamp fixing | |
| Conveying direction | From left to right, right to left | |
| Orbital height | 900±20mm | |
| Computer Configuration | Mainframe | CPU: Intel i5, RAM: DDR4-16G, GPU: GTX1660-6GB, SSD:250G, HDD: 2T |
| Monitor | 22"LED | |
| Operating system | Ubuntu | |
| Parameters | Overall size | W1350xD1000xH1600mm (excluding alarm light) |
| Weight | 1100KG | |
| Power source | AC220V/50~60Hz/2000W | |
| Air Pressure | 0.5Mpa | |
| Software Supported Input Formats | Support Gerber format (274X), ODB++ | |
| Statistical management tools |
Histogram,X-bar&R -Chart ,X-bar&S -C hart ,C p&C pk, %Gage R & R,SPI Daily/Weekly/Monthly Reports, real-time SPC& Multiple Display |
|
| Environmental requirements | Temperature: 5~40℃, relative humidity: 25%~80% (no frost) | |
| Upstream and downstream equipment communication | Standard SMEMA interface | |
Phase profile measurement principle
Object deforms (modulates) the sinusoidal pattern
Calculate sinusoidal phase and find height (demodulation)
Anti-interference, high precision, large range
1. The moving stripes ensure the ability to resist ambient light interference.
2. High-frequency stripes ensure high enough vertical resolution
3. Low-frequency stripes ensure a wide enough measuring range.
Comprehensive MES data interfacing capabilities and powerful SPC system
1. Real-time statistics of the top ten alarm components
2. The number of alarms can be set to lock the machine
3. Export the entire board image of each PCB in real time for subsequent traceability
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