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12megapixel 3D AOI Machine Measurement Comparison Optical Inspection

Product Details

Place of Origin: DONGGUAN

Brand Name: MENTO

Certification: FCC.ROHS,CCC

Model Number: K3212

Payment & Shipping Terms

Minimum Order Quantity: 3

Packaging Details: W1350xD1000xH1600mm

Delivery Time: 20 work days

Payment Terms: L/C, T/T

Supply Ability: 10pcs+20 work days

Get Best Price
Product Details
High Light:

12megapixel 3D AOI Machine

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Measurement 3D AOI Machine

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3D AOI optical inspection machine

Aoi:
Automated
Pcb Thickness:
0.2mm - 6mm
Dimension:
1000mm X 800mm X 1500mm
Camera:
High-resolution Digital Camera
Light Source:
LED
Inspection Accuracy:
99.9%
Software:
Advanced Image Processing Software
Aoi:
Automated
Pcb Thickness:
0.2mm - 6mm
Dimension:
1000mm X 800mm X 1500mm
Camera:
High-resolution Digital Camera
Light Source:
LED
Inspection Accuracy:
99.9%
Software:
Advanced Image Processing Software
Product Description

Online AOI features

1. High cost performance

2. Standard 5 million global exposure industrial color camera

3. The first company in China to use large-diameter telecentric lenses (can be targeted at products)

4. Independently developed optical system (light source consistency)

5. High stability integrated casting platform

Application scope: solder joint and mounted device inspection

 

K32 series 3D Solder Paste Inspection

 

Device model K3212
Detection capacity Detection items Miss print, over solder, insufficient solder, solder bridging, solder paste tailing, shape anomany, offset
Scanning method Stop&Go
Optical system Camera 12MP high-speed color industrial camera
Light Source Dual DLP light source (raster phase shift technology) and red, green and blue (RGB) light source
Resolution 10μm & 15um (optional)
Detection performance Height accuracy (calibration module) 1μm (using standard calibration block)
Volume repeatability <1% (standard verification block, 3Sigma)
Maximum Plate Bending Compensation Value ±3mm
Detection Capability GRR <10%at6o(+50%tolerance, 5μm resolution)
Maximum detection height 500μm
Solution to shadow problem Phase shift technology & bidirectional 3D Structured Light system
Plate bending real-time compensation method Plate Bend Compensation (Z-Tracking+Pad Referencing)
Test screen Color (3D and 2D images displayed together)
Driving equipment Servomotor+Screw Guide
Moving speed 800mm/s
Minimum measurable product size 50mmx50mm
Maximum product measurable size 400mmx500mm
PCB thickness 0.5~6mm
Track width adjustment Automatic width adjustment, manual width adjustment
Circuit board conveying/fixing Belt conveyor/pneumatic clamp fixing
Conveying direction From left to right, right to left
Orbital height 900±20mm
Computer Configuration Mainframe CPU: Intel i5, RAM: DDR4-16G, GPU: GTX1660-6GB, SSD:250G, HDD: 2T
Monitor 22"LED
Operating system Ubuntu
Parameters Overall size W1350xD1000xH1600mm (excluding alarm light)
Weight 1100KG
Power source AC220V/50~60Hz/2000W
Air Pressure 0.5Mpa
Software Supported Input Formats Support Gerber format (274X), ODB++
Statistical management tools

Histogram,X-bar&R -Chart ,X-bar&S -C hart ,C p&C pk,

%Gage R & R,SPI Daily/Weekly/Monthly Reports, real-time SPC& Multiple Display

Environmental requirements Temperature: 5~40℃, relative humidity: 25%~80% (no frost)
Upstream and downstream equipment communication Standard SMEMA interface
 
 

 

Phase profile measurement principle

Object deforms (modulates) the sinusoidal pattern

Calculate sinusoidal phase and find height (demodulation)

 

Anti-interference, high precision, large range

1. The moving stripes ensure the ability to resist ambient light interference.

2. High-frequency stripes ensure high enough vertical resolution

3. Low-frequency stripes ensure a wide enough measuring range.

12megapixel 3D AOI Machine Measurement Comparison Optical Inspection 0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

12megapixel 3D AOI Machine Measurement Comparison Optical Inspection 1

 

Comprehensive MES data interfacing capabilities and powerful SPC system

1. Real-time statistics of the top ten alarm components

2. The number of alarms can be set to lock the machine

3. Export the entire board image of each PCB in real time for subsequent traceability