Dongguan MENTO Intelligent Technology Co., Ltd. info@mento-mv.com 00-86-13410031559
Product Details
Place of Origin: DONGGUAN
Brand Name: MENTO
Certification: FCC.ROHS,CCC
Model Number: K2005
Payment & Shipping Terms
Minimum Order Quantity: 3
Packaging Details: W1000mmxD1380mmxH1600mm
Delivery Time: 20 work days
Payment Terms: L/C, T/T
Supply Ability: 10pcs+20 work days
Features: |
Duel-track Equipment |
Detection Speed: |
0.6 FOV/sec |
Precision: |
High Precision |
Camera: |
5MP, Color |
Display: |
23.8 Inch FHD Display |
Camera Type: |
CCD |
Weight: |
500kg |
Functionality: |
Industrial Use (SMT) |
Pcba: |
50*50~400*266mm |
Transport Direction: |
L-R OR R-L |
Port: |
Shenzhen |
Application: |
Solder Paste Optical Inspection SPI |
Optical Specification: |
FOV:400*266mm |
The Machine Size: |
W1080 X D1390 X H1840(mm) |
Power: |
Electronic |
Features: |
Duel-track Equipment |
Detection Speed: |
0.6 FOV/sec |
Precision: |
High Precision |
Camera: |
5MP, Color |
Display: |
23.8 Inch FHD Display |
Camera Type: |
CCD |
Weight: |
500kg |
Functionality: |
Industrial Use (SMT) |
Pcba: |
50*50~400*266mm |
Transport Direction: |
L-R OR R-L |
Port: |
Shenzhen |
Application: |
Solder Paste Optical Inspection SPI |
Optical Specification: |
FOV:400*266mm |
The Machine Size: |
W1080 X D1390 X H1840(mm) |
Power: |
Electronic |
| 2D Automated Optical Inspection Online Single-Track | |||
| Model | K2005 | ||
| Testing Capability | Test items | CHIP component body, CHIP component solder joints, characters, DIP solder joints | |
| Minimum component | CHIP:01005 Pitch:0.3mm | ||
| Detection Method | Deep Learning, Image Processing | ||
| Optical System | Camera | 5MP high speed color industrial camera | |
| Telecentric Lens | 0.345X/0.22X/0.17X | ||
| Resolution | 10um/15um/20um | ||
| FOV | 24x20mm/36x30mm/48x40mm | ||
| Detection Speed | 3FOV/s | ||
| Software System | Operating System | Ubuntu 20.04 | |
| Mechanical Properties | PCB thickness | 0.3~10mm(Warp≤5mm) | |
| Component Height | Upper 30mm, Lower 84mm(special height can be customized) | ||
| Driving device | Servomotor+Ball Screw+Linear Guideway | ||
| Moving speed | Max.600mm/s | Max.800mm/s | |
| Positioning accuracy | ≤8um(after calibration) | ||
| PCB transport guide | PCB rail transportation height:900+20mm(from ground to PCB rail transportation surface) | ||
| 600mmx700mm | |||
| Minimum distance between PCBs:≤90mm | |||
| Parameters | Curing method | AC220V/50Hz/2000W | |
| Detection screen | W1000mmxD1380mmxH1600mm(without foot 100±20mm) | ||
| Accuracy | 1100KG | ||
| Re-measurement Accuracy | ≥0.5MPa | ||
| Wafer Ring Size | Temperature:5~40℃, relative humidity 25%~80%(no frost) | ||
| Number of wafers handledsimultaneously | Standard SMEMA interface | ||
Product Features - Vision Systems(Online Single-Track)
Product testing capabilities(Online Single-Track)
9. Insufficient Soldering 10. Short Circuit 12. Offset 13.DIP Component Missing 14.DIP pins unextended....
Misplacement Missing Component Polarity Reversal Non-Wetting Pin Warpage
Normal Pin float Insufficient Soldering Bridging
Fast programming(Online Single-Track)
1. Automatically import database
2. Whole board parameter tuning
3. One-click link to the public library for components 4.Standard library
Offline programming(Online Single-Track)
Online and offline (office) non-stop machine parameter tuning.
Component collinearity detection(Online Single-Track/1.2m online Single-Track)
1. Calculate the rotation angle of the component
2. Calculate the range between the maximum and minimum offset of the component
3. Distance between components
4. The distance between the component and a reference point or a line
Collinearity detection (collinearity, absolute distance, collinearity range,component spacing)
Comprehensive MES data interfacing capabilities and powerful SPC system(Online Single-Track)
1. Real-time statistics of the top 10 alarm components
2. Enables setting an alarm count to automatically halt upstream equipment.
3. Export the entire board image of each PCB in real time for subsequent traceability
4. Indigenously developed MES interface supports standard and customized formats.
Summary Total percentage Top 10 defect types Top 10 defect components Top 10 False Positive components Pareto chart of the top 10 defect types
Labor-saving mode
Through data transmission and other methods, one person can review the AOI alarm data of multiple lines, thereby realizing a labor-saving mode.
Solder Paste Printer SPI Chip mounter Pre-reflow AOI Reflow oven Post-reflow AOI Collector
Product Features - Equipment Platform
The three-section track is detachable and can be changed according to the length of the product. It can be applied to various products and lines in the workshop.
1. The integral casting platform effectively eliminates structural stress and lays the foundation for machine accuracy and stability.
2. Pull-out electronic control component platform makes maintenance more user-friendly.
3. Professional and beautiful appearance design, more in line with ergonomics and visual aesthetics.
Product inspection capabilities
Misplacement offset tilt common defective
Missing Component Socket offset Diode offset Insufficient glue glue offset
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