Dongguan MENTO Intelligent Technology Co., Ltd. Company News

On March 28, the Henan Electronic Intelligent Manufacturing Industry Alliance Annual Exchange Conference and the 111th CEIA China Electronic Intelligent Manufacturing Summit Forum were successfully held in Zhengzhou. Zhengzhou, as an important city in central China, is emerging as the center of the intelligent manufacturing industry with its strong wisdom and innovation capabilities. This conference focused on the fields of instrumentation, smart home appliances, EV automotive electronics, etc., and attracted the attention of industry professionals. Important leaders from the Henan Institute of Electronics and the Henan Electronic Intelligent Manufacturing Industry Alliance attended the event and had friendly exchanges. More than 350 industry professionals Colleagues attend the meeting. Participants at the event came from Henan Electronics Society, Henan Electronic Intelligent Manufacturing Industry Alliance, Gree Electric Appliances, the Fifth Institute of Electronics of the Ministry of Industry and Information Technology, Midea, Mengtuo Intelligence, Antu Experimental Instruments, Fuding Precision, Hanwei Technology, Sisi Seiko, Tianhai Electric, and Xintian Technology , Hangsheng Automotive Electronics, Jingyida Automobile, Luoyang Electro-Optical Equipment Research Institute, Ruijie Micro Technology, Senpeng Electronics, Xinkaip Electronics, Meida High Frequency Electronics, Xuji Electric, Yanfeng, Aerospace Electronics, Jingchengda Electronics, Colleagues from Weicom, Xinjiye Automotive Electronics, Zhongzhi Technology, the 27th China Electronics Technology Institute and other organizations and well-known enterprises gathered together. Mr. Tang Yangshu, Chairman of Mengtuo Intelligent, delivered a wonderful speech titled "Application and Research of Industrial Machine Vision and AI Technology in Electronics and Pan-Semiconductor Fine Pitch Packaging". Mr. Tang shared about the application of industrial machine vision and AI technology in electronics. And the application and research content in pan-semiconductor micro-pitch packaging. Electronic and pan-semiconductor micro-pitch packaging manufacturers are in urgent need of support from supporting equipment and solutions in the face of large-scale product production, process improvement and manufacturing requirements. Currently, the advanced manufacturing industry has a need to increase and adjust existing equipment functions and improve equipment performance. Urgent needs. Montop Intelligence provides professional quality management solutions for advanced manufacturers of electronic and pan-semiconductor micro-pitch packaging. Montop Intelligent has been insisting on deeply cultivating industrial machine vision software systems for 15 years. In 2024, it released the world's first integrated visual inspection platform ideaPi, forming a 1+3 industrial machine vision product strategy to serve Mini/Micro LED new models with the spirit of industrial farmers. Display, SMT integrated circuit inspection, SiP semiconductor system-level packaging, MVS general vision and other fields contribute to high-end intelligent manufacturing in China and around the world.

On April 18, the 112th CEIA China Electronic Intelligent Manufacturing Summit Forum and the Annual Exchange Conference of the Electronic Manufacturing Technology Committee of the Shandong Electronics Society were successfully held in Qingdao. This conference focused on the fields of high reliability and intelligent manufacturing, advanced packaging and system integration. It attracted more than 300 industry colleagues and received widespread attention and praise from industry insiders. In this forum, Mr. Tang Yangshu, Chairman of Mengtuo Intelligent, delivered a speech titled "Industrial Machine Vision IdeaPi and Its Application and Research in Pan-Semiconductor Packaging". The industrial machine vision system ideaPi is the world's first integrated platform for visual inspection and maintenance. With its high efficiency and accuracy, it has been widely used in many industrial fields. Through vivid cases and in-depth explanations, this speech discussed the specific application of ideaPi in the pan-semiconductor packaging process, as well as the technical challenges and solutions faced in actual production; it also analyzed in detail the ten advantages and six major advantages of ideaPi. The reasons for the selection and its key role in semiconductor packaging demonstrated to the participants how the application of ideaPi can help significantly improve production efficiency and product quality in the field of pan-semiconductor packaging. It is expected to contribute to the upgrading and development of related industries.  The full-station inspection solution for the SMT-AOI production line was displayed on the Montop Intelligent booth, attracting the attention of many visitors. Montop Intelligent will begin to provide a full range of testing equipment solutions for SMT integrated circuit manufacturers in March 2024, helping to Integrated circuit process quality inspection and control fully demonstrate the strong strength of Mengtuo Intelligent in technological innovation and industrial upgrading. By participating in the CEIA China Electronics Smart Manufacturing Summit Forum Qingdao Station, Mengtuo Intelligent not only demonstrated its leading technologies and product solutions for quality inspection and control in the field of integrated circuits and semiconductor advanced packaging, but also conveyed a clear message to the public. Information: Intelligent manufacturing is becoming a powerful engine to promote industrial development. Mengtuo Intelligence will work with partners to jointly promote the intelligentization process of Chinese industry. In the wave of intelligent manufacturing, Mengtuo Intelligence will continue to be driven by innovation, continue to explore and practice, and contribute more wisdom and strength to the development of industry. The story of Qingdao’s industrial development continues, and Mengtuo Intelligence will write this wonderful chapter with you.