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SiP Full-panel Coordinate Output Equipment(In-line High-precision)

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SiP Full-panel Coordinate Output Equipment

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Product Features

1.A parallel CPU+GPU+FPGA architecture rapidly generates tens to hundreds of millions of absolute coordinates with sub-micron precision, compatible with mass transfer equipment such as chip-prick machines.

2.To address the conflict between shrinking chip sizes and expanding substrate sizes, it employs block-stitching and dynamic compensation technologies. This enables grid-based scanning and seamless stitching of the entire board to output a true physical coordinate point cloud map.

3.A multi-layer alignment algorithm compensates for deformation errors, while global expansion/contraction fitting with multiple Mark points provides a dynamic placement navigation map.


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