AI Review and One-Click Programming in the Spotlight; Company Showcases Full Range of Inspection Equipment at 2026 Shenzhen Electronics Exhibition
During the 2026 Shenzhen Electronics Exhibition, the company presented a comprehensive lineup of inspection and process equipment, including AOI, SPI, SiP inspection, warpage inspection equipment, glue removal machines, and gold wire inspection. Among the many highlights, AI review and one-click programming emerged as the core attractions of the booth.
Live Demonstrations Win Praise from Industry Visitors
Through live on-site demonstrations, the two flagship functions garnered high praise from numerous industry customers and professional visitors. Engineers and procurement teams gathered at the booth to watch the systems in action, creating a lively atmosphere of exchange throughout the show.
AI Review: Deep-Learning Secondary Judgment
Powered by deep-learning algorithms, AI review performs intelligent secondary judgment on inspection results from AOI, SPI, and other systems. By automatically re-verifying suspect defects, it effectively reduces false positives and improves production line first-pass yield — freeing operators to focus only on the cases that genuinely require human attention.
One-Click Programming: Faster Changeover, Flexible Production
One-click programming significantly simplifies the program creation process, shortens changeover time, and enables rapid switching and flexible production. What once took hours of skilled setup is reduced to a single guided action, lowering the expertise barrier for new lines and new products. At the demonstration site, visitors fully recognized the practicality and intelligence of these two functions.
Full Product Lineup on Display
| Equipment |
Function |
| AOI | Automated Optical Inspection for solder, placement and polarity defects. |
| SPI | Solder Paste Inspection that catches print defects before reflow. |
| SiP Inspection | Inspection support for advanced, high-density System-in-Package assemblies. |
| Warpage Inspection Equipment | Measures board and package warpage to protect assembly quality. |
| Glue Removal Machines | Precision glue removal for rework and process preparation. |
| Gold Wire Inspection | Verifies gold wire bonding integrity for high-reliability products. |
Applications Across Advanced Manufacturing
The products exhibited cover multiple fields, including SMT, advanced packaging, and precision electronics manufacturing, fully demonstrating the company's comprehensive strength in intelligent inspection and process equipment. From high-mix SMT lines to advanced packaging, the lineup delivers reliable inspection at every stage.
Looking Ahead
In the future, the company will continue to deepen its efforts in AI and automation technology, providing customers with more efficient and reliable intelligent inspection solutions. Building on the success of the 2026 Shenzhen Electronics Exhibition, the team remains committed to helping manufacturers raise yield, reduce false calls, and achieve greater flexibility on the line.
Exhibition Gallery
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